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Engineering Questionnaire
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PCB Layout
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PCB Assembly


Services: PCB Design


  --- PCB Layout RFQ ---

         
Company Name:
 
Customer Name:
Address:
 
Address2:
Main Phone:
 
Direct #/Ext:
Design Name:
 
Fax #:
Design P/N:
 
Rev:
CAD Tool:
 
Version:
   Technical
CST Template Database Available:
Yes    No
CST Logo Available:
Yes    No (Gerber Preferred)
CST Design Requirements Received:
Yes    No
CST Check Requirements Received:
Yes    No
CST Deliverables Requirements Received:
Yes    No
CM Design Requirements Received:
Yes    No
Creative Exchange, Inc. Design Process Forwarded to CST: Yes    No
   Design Spec. Requirement: IPC  Mil Spec  Other:  
   Mech./Restriction Drawing Provided: Yes No   Other:
  Schematic Capture Type:  NetList Format: Other:
   Allegro Device Files Provided: Yes No      Missing CAD Footprints: Yes No
   Routing Type:                  Assembly Type:
   Height Restrictions: Yes No     
          Comments:
   Board Size: (L) x (W)      Material: FR4    Other:
   Machining: Breakaways      V-Score       Milling
          Comments:
    Finish:        Other:
    Selective Gold: Yes No        Area:
    Gold Fingers: Yes No       Plating Bar Added: Yes  No
    Nominal Board Thickness:  Other: mils    
    No. of Layers:   Actual   EST
     X-Section Provided: Yes No          Window Box: Yes No
       (Fill out X-Section Chart at bottom of document)
     Outer Cu Weight: Oz.
     Inner Signal Cu Weight: Oz.
     Inner Plane Cu Weight: Oz.
     Board Level Testing:
     Min Standard Line Trace Width/Spacing: Width mils   Spacing mils
     Impedance Controlled: Yes   No       Edge Coupled    Broad Sided
     Impedance Controlled (ASCII) List(s) Provided:    Yes   No
  1.    Imp. Value: Ohms    Width: mils     Spacing: mils      Layer(s):
  2.    Imp. Value: Ohms    Width: mils     Spacing: mils      Layer(s):
  3.    Imp. Value: Ohms    Width: mils     Spacing: mils      Layer(s):
  4.    Imp. Value: Ohms    Width: mils     Spacing: mils      Layer(s):
  5.    Imp. Value: Ohms    Width: mils     Spacing: mils      Layer(s):
  6.    Imp. Value: Ohms    Width: mils     Spacing: mils      Layer(s):
  7.    Imp. Value: Ohms    Width: mils     Spacing: mils      Layer(s):
  8.    Imp. Value: Ohms    Width: mils     Spacing: mils      Layer(s):
   Critical Clocks: Yes No     
   Critical Clocks (ASCII) List(s) Provided: Yes No
   Differential Pairs: Yes No  
   Differential Pairs (ASCII) List(s) Provided: Yes No
   Critical Clocks Special Requirements: Yes No     
   Differential Pairs Special Requirements.: Yes No
   Any Matched Length Requirements: Yes No
   Lists Defined in Constraints: Yes No      ASCII Lists Hierarchical: Yes No
   Comments:
                 NOTE: ALL ASCII List(s) provided by Customer should be in Soft Format!
   Smallest Hole Size (per Aspect Ratio): mils    Mfg. Aspect Ratio Coefficient:
   Acceptable Aspect Ratio: Yes No    If NOT, Contact CST/Mfg.: Yes No
   Total Hole Count:     Total # of Drills:
   Total # of SMD Pads:   SMD Pads Top:
   SMD Pads Bottom:     Smallest SMD/BGA Pitch: mils
   Solder Mask Type: Other:      Solder Mask Color:
   Silkscreen:      Silkscreen Color:
   3 Corner Board Level Fiducials: Yes No    
   Active Comps:      Passive Comps:
   Panelization: Yes No    # /Panel Size X
   Direction of Flow/Reflow: Other:     Process Type:
   Comments:
   ATE Test Probe: Yes No   
   Hierarchical Critical (ASCII) List(s) Provided: Yes No
   TP Geometry:       TP Layer:
Min. Top TP Size:
mils
Min. Top TP Pitch:
mils
Min. Bottom TP Size:
mils
Min. Bottom TP Pitch:
mils
   Rename/Resequence: Yes No     
   Resequence Direction:      Other:
(T=Top; B=Bottom; L=Left; R=Right)
   Comments:
BOARD X-SECTION CHART
 Layer
Signal
Plane
Cu Oz
Impedance Ohm
Imp Line Widht/Space
Thickness (mils)
Comments
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